Intelligent Volume Control Ultrasonic Atomization Spraying Equipment

As a core material in high-end manufacturing fields such as semiconductors and display panels, the coating quality of photoresist directly determines key performance indicators such as chip resolution and panel pixel density. Traditional photoresist coating methods primarily use spin coating, which, while simple to operate, has significant limitations: First, material utilization is low (only 30%-40%), with a large amount of photoresist wasted due to centrifugal force, increasing production costs; second, coating uniformity is limited by the substrate size, with large wafers or flexible substrates prone to the "edge effect" of thicker edges and thinner centers; third, the coating thickness control precision is insufficient, making it difficult to meet the stringent requirements of advanced processes (such as chips below 7nm) for nanoscale coatings; and fourth, defects such as bubbles and pinholes are easily generated, affecting the integrity of the photolithography pattern.

With the evolution of semiconductor chips towards higher density and smaller sizes, and display panels towards larger sizes and greater flexibility, photoresist coating urgently needs new technologies that combine high precision, high utilization, and low defect rates. Ultrasonic atomization spraying equipment, with its unique atomization principle, has become a core solution to address these pain points.

Key Application Scenarios in the Photoresist Industry:

◆ Semiconductor Chip Photoresist Coating: In the manufacturing of logic chips and memory chips (such as DRAM and NAND), ultrasonic atomization spraying can be used for bottom anti-reflective coating (BARC), main photoresist coating, and top anti-reflective coating (TARC) on the wafer surface. For extreme ultraviolet (EUV) lithography processes, the equipment can achieve ultra-thin (≤100nm), low-roughness (Ra≤0.5nm) photoresist coatings, improving the resolution and edge roughness (LER) performance of the lithography pattern.

◆ Photoresist Coating for Display Panels: In the manufacturing processes of pixel definition layers (PDLs), color filters (CFs), and touch electrodes in LCD and OLED display panels, the equipment can be adapted to uniformly coat large-size substrates (such as G8.5 and G10.5), solving the warpage problem during coating of flexible OLED substrates (such as PI films), while improving the adhesion between the photoresist and the substrate and reducing pattern offset in subsequent development and etching processes.

◆ Photoresist Coating for MEMS and Advanced Packaging: In microelectromechanical systems (MEMS) and advanced chip packaging (such as WLCSP and CoWoS), photoresist is often used as a temporary bonding layer, passivation layer, or pattern transfer medium. Ultrasonic atomization spraying can achieve uniform coating of complex three-dimensional structures (such as high aspect ratio trenches and bump arrays), ensuring the integrity of the coating coverage in a confined space and meeting the high-precision alignment requirements of the packaging process.

◆Special Functional Photoresist Coating: For special functional photoresists such as photosensitive resins and quantum dot photoresists, the equipment can precisely control atomization parameters to avoid the aggregation of functional particles (such as quantum dots and nanofillers), maintain the optical performance and photolithographic sensitivity of the photoresist, and adapt to the application needs of emerging display, sensing and other fields.